Fingerprint Cards teaming-up with Qualcomm to pre-integrate capacitive fingerprint technology on low- and mid-tier Qualcomm Snapdragon mobile platforms

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Fingerprint Cards is teaming-up with Qualcomm to pre-integrate Fingerprints’ FPC1028 biometric fingerprint touch capacitive sensor into Qualcomm® Snapdragon™ 435, 430, 427 and 425 Mobile Platforms, as well as Qualcomm 210 and 212 Mobile Platforms.

The combination of Qualcomm’s industry-leading mobile platforms and Fingerprints’ high performance  capacitive biometric fingerprint solutions provides customers with a smooth and convenient user experience.

Smartphone original equipment manufacturers (OEMs) can now have access to preintegrated fingerprint technology on selected Snapdragon 400 and Qualcomm 200 Mobile Platforms.

The FPC1028 touch sensor is the mobile industry’s smallest and most affordable fingerprint sensor optimized for front and rear integration, thereby supporting flexible industrial design. It also provides customers with a best-in-class mobile solution with pre-integrated biometrics addressing low- and mid-tier devices.

Christian Fredrikson, CEO of Fingerprints says,

“We are excited to work with Qualcomm Technologies, an industry leader in mobile technology. Together, we will provide our customers with a solution for low- and mid-tier fingerprint-enabled smartphones. We believe this will rapidly increase the fingerprint sensor attach rate in low- and mid-tier mobile devices worldwide. Our strategy is to be the market leader in all our segments, so this collaboration is fully aligned with our communicated plan. We expect the first products to become available on the market during the second half of 2017,”

Kedar Kondap, Vice President, Product Management, Qualcomm Technologies, Inc added,

“Qualcomm Technologies and Fingerprint Cards both share the same vision – to enable a compelling capacitive biometric use case into low and mid-tier devices to create even more differentiation for our customers at attractive price points. This synergistic relationship is expected to greatly accelerate the availability for such solutions,”